Category: Linear integrated circuits and applications.

Diffusion basics & constant source diffusion

In the previous chapter, we saw that the silicon should be changed to “N” type or “P” type by adding…

ETCHING

Etching PCB is to use the materials of chemical reactions or physical impact of technologies that are removed. Etching techniques…

X-ray Lithography

X-ray lithography  uses collimated x-rays as the exposing energy. Being much shorter in wavelength than light, even DUV light, x-rays provide…

Optical Lithography

The name optical lithography comes from the early application where the exposing energy was visible light. While those wavelengths can…

Photomask manufacture

Introduction Photomasks used for optical lithography contain the pattern of the integrated circuits. The basis is a so called blank: a…

photolithography

Photolithography is the standard method of printed circuit board (PCB) and microprocessor fabrication. The process uses light to make the…

Physics of Thermal Oxidation

THERMAL OXIDATION is a chemical process, where silicon dioxide (SiO) is grown in an ambient with elevated temperatures. A simple…

Molecular Beam Epitaxy (MBE)

MBE – overview MBE equipment MBE main blocks MBE process characteristics Effusion cell Growth mechanism MBE system

Vapor phase epitaxy

Epitaxial Growth

Epitaxy is used to deposit N on N+ silicon, which is impossible to accomplish by diffusion. It is also used…

Crystal Growth and Wafer Preparation

In this process following subprocesses, are involved – (i) Crystal growing (ii) Ingot trimming and grinding (iii) Ingot slicing (iv)…

Producing Semiconductor-Grade Silicon

Introductory Remarks Ø  It is written somewhere that in the beginning God created heaven and the earth. It is not written…