Dry etching
In dry etching, chemical reaction occurs between the material on the wafer and the gases. In this method,…
August 11, 2021 · Prabhu TLPrabhu TL is a SenseCentral contributor covering digital products, entrepreneurship, and scalable online business systems. He focuses on turning ideas into repeatable processes—validation, positioning, marketing, and execution. His writing is known for simple frameworks, clear checklists, and real-world examples. When he’s not writing, he’s usually building new digital assets and experimenting with growth channels.
In dry etching, chemical reaction occurs between the material on the wafer and the gases. In this method,…
August 11, 2021 · Prabhu TLWe saw that during deposition, it is not possible to deposit a material only in the places that…
August 11, 2021 · Prabhu TLDopant redistribution: The doped silicon is oxidized in some places, as part of the process sequence. The dopants which…
August 11, 2021 · Prabhu TLA plot of the concentration profile (normalized with respect to Cs) , at various times, is given here.…
August 11, 2021 · Prabhu TL
Collimated and Ionized Metal Plasma (IMP): There are some more advanced techniques in the PVD. One is called collimated…
August 11, 2021 · Prabhu TL
In this chapter we will see various deposition techniques that are used in microelectronic fabrication. If a material…
August 11, 2021 · Prabhu TL
In semiconductor manufacturing the term “oxidation” is used to refer the conversion of silicon to silicon dioxide. This…
August 11, 2021 · Prabhu TL
Why are the neutral atoms removed from the beam just before deposition? The total quantity of impurities added…
August 11, 2021 · Prabhu TL
We saw that material can be deposited on the silicon wafer by various techniques such as PVD, CVD etc. The…
August 11, 2021 · Prabhu TL
In the previous chapter, we saw that the silicon should be changed to “N” type or “P” type…
August 11, 2021 · Prabhu TL